Exceptional experience and technologies to design and produce lighter, thinner and smaller devices for next-generation IT and consumer electronics markets.

Miniaturization Design Techniques:

• Use smaller package of parts  :

• Evolution of IC package: DIP -- SOP -- QFP -- TQFP -- VSQFP -- BGA -- QFN -- COB

• Evolution of smaller SMD passive components package: 1206 -- 0805 -- 0603 -- 0402 -- 0201

• Smaller connectors, and other parts

• Multi-layer PCB are often used to minimize PCB size, more layer of PCB layout will make smaller PCB size.

• A smaller PCB design is possible by experienced engineers to spend extra time and efforts to optimize parts placement and circuit routing.

• Heat and signal noise are critical issues which need to be specially taken cared. 

   

With our engineers' experience and their extra efforts, we are able to use  the most up-to-date EDA (Electronic Design Automation) tools to minimize the PCB design to the smallest size possible.  Those often seen problems of miniaturized PCB design such as noise and heat are carefully taken cared to ensure robustness of function and reliability.